钨溅射靶
钨靶，又称钨溅射靶，是以纯钨粉为原料制成的产品。它具有银白色的外观，由于其优异的物理和化学性能，在许多领域都很受欢迎。
钨溅射靶 细节
Material: W1
Type: flat target, rotating target
Shape: tubular, square, round, long strip
Purity: 99.95%, 99.97%
Conventional density: 19.0g/cm3~19.2g/cm3
High density: >19.2g/cm3
Size: processed according to the drawing to meet the precision requirements
Product features: high density, high purity, fine grains, good density
The main uses of tungsten targets include:
1. Preparation of electronic devices: Tungsten targets are widely used in the preparation of electronic devices, such as integrated circuits (ICs), flat panel displays (FPDs), solar cells, etc. During the preparation process, the tungsten target is placed in a target gun in a vacuum chamber, and tungsten atoms or ions are released through ion bombardment or electron beams, which are deposited on the surface of the substrate to form the required tungsten film.
2. Conductive materials: Tungsten targets are often used in the preparation of conductive materials due to their good conductivity and high melting point. They can be used to prepare high-temperature resistors, electrode materials, high-power electronic devices, etc.
Users of tungsten targets include semiconductor manufacturers, display manufacturers, photovoltaic industry, electronic device manufacturers, scientific research institutions, etc. These industries and units widely use tungsten targets in the fields of film preparation, material research, and electronic device production.
Process flow:
Flat target: tungsten powder-pressing-sintering-rolling-deep processing-surface treatment-finished product-testing-packaging
Small rotary target: tungsten powder-pressing-sintering-forging-deep processing-surface treatment-finished product-testing-packaging
Large rotary target: tungsten powder-pressing-sintering-deep processing-surface treatment-finished product-testing-packaging
标签 :
钨溅射靶材用于磁控溅射涂层。溅射涂层是物理气相沉积（PVD）的主要方法之一。它用于在表面沉积具有特殊功能的薄膜。溅射靶材主要用于平板显示器涂层、半导体涂层、玻璃涂层、太阳能电池涂层、装饰涂层等行业。
